Cu-Ni-Si-Mn-Sn based Copper alloy material with excellent strength electrical conductivity and bendability and method for preparing the same

The present invention relates to a Cu-Ni-Si-Mn-Sn-based copper alloy material with excellent strength, electrical conductivity and bendability and a preparation method thereof. The Cu-Ni-Si-Mn-Sn-based copper alloy material of the present invention comprises 3.2 to 4.5 wt% of nickel (Ni), 0.7 to 1.2...

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Bibliographische Detailangaben
Hauptverfasser:	PARK CHEOL MIN, MUN SUN YOUNG, NAM HYO MOON, KIM JUN HYUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	The present invention relates to a Cu-Ni-Si-Mn-Sn-based copper alloy material with excellent strength, electrical conductivity and bendability and a preparation method thereof. The Cu-Ni-Si-Mn-Sn-based copper alloy material of the present invention comprises 3.2 to 4.5 wt% of nickel (Ni), 0.7 to 1.2 wt% of silicon (Si), and 0.8 to 1.5 wt% of manganese (Mn), 0.1 to 0.5 wt% of tin (Sn), and the balance copper (Cu) and unavoidable impurities, wherein the total content of the unavoidable impurities is 0.5 wt% or less and the unavoidable impurities are one or more selected from the group consisting of Mg, P, Ca, Ti, V, Zn, Fe, Zr, and Cr. 본 발명은 강도, 전기전도도 및 굽힘가공성이 우수한 특성을 가진 구리-니켈-실리콘-망간-주석(Cu-Ni-Si-Mn-Sn)계 동합금재 및 그의 제조 방법에 관한 것이다.