METHOD FOR MANUFACTURING STEP TYPE LIGHTING DEVICE BY USING A BENDABLE PRINTED CIRCUIT BOARD
According to an embodiment of the present invention, a lighting device manufacturing method using a bendable printed circuit board (PCB), performed by a lighting device manufacturing system, comprises: a PCB bending step of transferring a PCB to a predetermined stair-shaped bending jig and then bend...
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| creator | CHOI JAE HWAN KIM YONG SUNG KIM BYEONG GU LEE MYON YONG |
| description | According to an embodiment of the present invention, a lighting device manufacturing method using a bendable printed circuit board (PCB), performed by a lighting device manufacturing system, comprises: a PCB bending step of transferring a PCB to a predetermined stair-shaped bending jig and then bending the PCB in the stair shape by arranging the PCB along the surface of the bending jig; a PCB pickup step of picking up the bent PCB and transferring the bent PCB to a backplate having the same shape as the stair shape; and a PCB assembly step of assembling the bent PCB to the backplate. The PCB is a strip-shaped substrate on which a plurality of light emitting elements are spaced apart at predetermined intervals and mounted thereon. Accordingly, missing substrates and backplates can be minimized.
본 발명의 일 실시예에 따르는, 조명장치 제조시스템에 의해 수행되는, 벤딩(Bending) 가능한 PCB(Printed Circuit Board)를 이용한 조명장치 제조방법은, PCB를 기 설정된 계단 형상의 벤딩용 지그(Jig)로 이송한 후, 상기 PCB를 상기 벤딩용 지그의 표면을 따라 배치시킴으로써, 상기 PCB를 상기 계단 형상으로 벤딩하는, PCB벤딩 단계; 상기 벤딩된 PCB를 픽업하여 상기 계단 형상과 동일한 형상을 포함하는 백플레이트(backplate)로 이송하는 PCB픽업 단계; 및 상기 벤딩된 PCB를 상기 백플레이트에 조립하는, PCB조립 단계;를 포함하되, 상기 PCB는 복수의 발광소자가 기 설정된 간격을 가지고 이격되어 실장되는 띠 형상의 기판인 것이다. |
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본 발명의 일 실시예에 따르는, 조명장치 제조시스템에 의해 수행되는, 벤딩(Bending) 가능한 PCB(Printed Circuit Board)를 이용한 조명장치 제조방법은, PCB를 기 설정된 계단 형상의 벤딩용 지그(Jig)로 이송한 후, 상기 PCB를 상기 벤딩용 지그의 표면을 따라 배치시킴으로써, 상기 PCB를 상기 계단 형상으로 벤딩하는, PCB벤딩 단계; 상기 벤딩된 PCB를 픽업하여 상기 계단 형상과 동일한 형상을 포함하는 백플레이트(backplate)로 이송하는 PCB픽업 단계; 및 상기 벤딩된 PCB를 상기 백플레이트에 조립하는, PCB조립 단계;를 포함하되, 상기 PCB는 복수의 발광소자가 기 설정된 간격을 가지고 이격되어 실장되는 띠 형상의 기판인 것이다.</description><language>eng ; kor</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR ; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL ; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE ; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220701&DB=EPODOC&CC=KR&NR=102415227B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220701&DB=EPODOC&CC=KR&NR=102415227B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI JAE HWAN</creatorcontrib><creatorcontrib>KIM YONG SUNG</creatorcontrib><creatorcontrib>KIM BYEONG GU</creatorcontrib><creatorcontrib>LEE MYON YONG</creatorcontrib><title>METHOD FOR MANUFACTURING STEP TYPE LIGHTING DEVICE BY USING A BENDABLE PRINTED CIRCUIT BOARD</title><description>According to an embodiment of the present invention, a lighting device manufacturing method using a bendable printed circuit board (PCB), performed by a lighting device manufacturing system, comprises: a PCB bending step of transferring a PCB to a predetermined stair-shaped bending jig and then bending the PCB in the stair shape by arranging the PCB along the surface of the bending jig; a PCB pickup step of picking up the bent PCB and transferring the bent PCB to a backplate having the same shape as the stair shape; and a PCB assembly step of assembling the bent PCB to the backplate. The PCB is a strip-shaped substrate on which a plurality of light emitting elements are spaced apart at predetermined intervals and mounted thereon. Accordingly, missing substrates and backplates can be minimized.
본 발명의 일 실시예에 따르는, 조명장치 제조시스템에 의해 수행되는, 벤딩(Bending) 가능한 PCB(Printed Circuit Board)를 이용한 조명장치 제조방법은, PCB를 기 설정된 계단 형상의 벤딩용 지그(Jig)로 이송한 후, 상기 PCB를 상기 벤딩용 지그의 표면을 따라 배치시킴으로써, 상기 PCB를 상기 계단 형상으로 벤딩하는, PCB벤딩 단계; 상기 벤딩된 PCB를 픽업하여 상기 계단 형상과 동일한 형상을 포함하는 백플레이트(backplate)로 이송하는 PCB픽업 단계; 및 상기 벤딩된 PCB를 상기 백플레이트에 조립하는, PCB조립 단계;를 포함하되, 상기 PCB는 복수의 발광소자가 기 설정된 간격을 가지고 이격되어 실장되는 띠 형상의 기판인 것이다.</description><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</subject><subject>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</subject><subject>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</subject><subject>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwjAQRbtxIeodBlwLtipdZ5JpE2yTkk6EglCKxJVood4fLXgAV5_3eH-ZXGti7RQUzkMtbCiE5OCNLaFlaoC7hqAypeZZKboYSYAdhHZmAUhWCawImu-HSYE0XgbDgE54tU4W9-Exxc1vV8m2IJZ6F8dXH6dxuMVnfPdnn-6zY3rKshwxPfxXfQBewzL3</recordid><startdate>20220701</startdate><enddate>20220701</enddate><creator>CHOI JAE HWAN</creator><creator>KIM YONG SUNG</creator><creator>KIM BYEONG GU</creator><creator>LEE MYON YONG</creator><scope>EVB</scope></search><sort><creationdate>20220701</creationdate><title>METHOD FOR MANUFACTURING STEP TYPE LIGHTING DEVICE BY USING A BENDABLE PRINTED CIRCUIT BOARD</title><author>CHOI JAE HWAN ; KIM YONG SUNG ; KIM BYEONG GU ; LEE MYON YONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR102415227BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</topic><topic>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</topic><topic>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</topic><topic>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI JAE HWAN</creatorcontrib><creatorcontrib>KIM YONG SUNG</creatorcontrib><creatorcontrib>KIM BYEONG GU</creatorcontrib><creatorcontrib>LEE MYON YONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI JAE HWAN</au><au>KIM YONG SUNG</au><au>KIM BYEONG GU</au><au>LEE MYON YONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING STEP TYPE LIGHTING DEVICE BY USING A BENDABLE PRINTED CIRCUIT BOARD</title><date>2022-07-01</date><risdate>2022</risdate><abstract>According to an embodiment of the present invention, a lighting device manufacturing method using a bendable printed circuit board (PCB), performed by a lighting device manufacturing system, comprises: a PCB bending step of transferring a PCB to a predetermined stair-shaped bending jig and then bending the PCB in the stair shape by arranging the PCB along the surface of the bending jig; a PCB pickup step of picking up the bent PCB and transferring the bent PCB to a backplate having the same shape as the stair shape; and a PCB assembly step of assembling the bent PCB to the backplate. The PCB is a strip-shaped substrate on which a plurality of light emitting elements are spaced apart at predetermined intervals and mounted thereon. Accordingly, missing substrates and backplates can be minimized.
본 발명의 일 실시예에 따르는, 조명장치 제조시스템에 의해 수행되는, 벤딩(Bending) 가능한 PCB(Printed Circuit Board)를 이용한 조명장치 제조방법은, PCB를 기 설정된 계단 형상의 벤딩용 지그(Jig)로 이송한 후, 상기 PCB를 상기 벤딩용 지그의 표면을 따라 배치시킴으로써, 상기 PCB를 상기 계단 형상으로 벤딩하는, PCB벤딩 단계; 상기 벤딩된 PCB를 픽업하여 상기 계단 형상과 동일한 형상을 포함하는 백플레이트(backplate)로 이송하는 PCB픽업 단계; 및 상기 벤딩된 PCB를 상기 백플레이트에 조립하는, PCB조립 단계;를 포함하되, 상기 PCB는 복수의 발광소자가 기 설정된 간격을 가지고 이격되어 실장되는 띠 형상의 기판인 것이다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE PRINTED CIRCUITS WEAPONS |
| title | METHOD FOR MANUFACTURING STEP TYPE LIGHTING DEVICE BY USING A BENDABLE PRINTED CIRCUIT BOARD |
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