EPOXY ADHESIVE COMPOSITION MANUFACTURING METHOD EPOXY ADHESIVE COMPOSITION AND COVERLAY CONTAINING THE SAME

Disclosed in the present specification are an epoxy adhesive composition manufacturing method, an epoxy adhesive composition, and a coverlay containing the same. The epoxy adhesive composition manufacturing method includes: a step of manufacturing a mixed liquid containing an epoxy resin and a stren...

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Bibliographische Detailangaben
Hauptverfasser:	NHO SEUNG HOON, NA HYEONG KYUN, HEO KYUN, YOO KYUNG SEOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed in the present specification are an epoxy adhesive composition manufacturing method, an epoxy adhesive composition, and a coverlay containing the same. The epoxy adhesive composition manufacturing method includes: a step of manufacturing a mixed liquid containing an epoxy resin and a strengthening agent; a step of making the mixed liquid pass through a filter containing a moisture removing agent; and a step of obtaining an epoxy resin by adding a filler and an amine hardening agent to the mixed liquid. According to the present invention, moisture can be efficiently removed in the process of manufacturing an epoxy resin. 본 명세서에는 에폭시 접착제 조성물 제조방법, 에폭시 접착제 조성물 및 이를 포함하는 커버레이가 개시된다.