WIRE CUTTING MOLD MACHINE

The present invention is a wire cutting mold device, which is for preventing wire derailment by safely guiding a wire through a groove for guiding wires having different thicknesses while maintaining tension on the wire used for wire cutting. The wire cutting mold device includes a work table; a mov...

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Hauptverfasser: BAEK SEOK JUN, SON IN SOO
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention is a wire cutting mold device, which is for preventing wire derailment by safely guiding a wire through a groove for guiding wires having different thicknesses while maintaining tension on the wire used for wire cutting. The wire cutting mold device includes a work table; a moving frame part; an upper winding part; and a guide roller. 본 발명은 와이어커팅 금형장치로, 와이어커팅에 사용되는 와이어에 장력을 유지하며, 상이한 두께를 지니는 와이어를 유도하는 홈을 통해 와이어를 안전하게 유도하여 와이어의 탈선을 방지하는 발명이다.