folding apparatus for wafer film
According to an aspect of the present invention, a wafer film folding device comprises: a lifting unit for lifting an edge portion of the wafer film on which a bar code is formed to be spaced apart from an upper surface of a lower vacuum chuck while the wafer film is placed on the lower vacuum chuck...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | According to an aspect of the present invention, a wafer film folding device comprises: a lifting unit for lifting an edge portion of the wafer film on which a bar code is formed to be spaced apart from an upper surface of a lower vacuum chuck while the wafer film is placed on the lower vacuum chuck; and a folding unit for folding the edge portion of the wafer film lifted by the lifting unit.
본 발명의 일 측면에 의한 웨이퍼 필름 폴딩 장치는, 웨이퍼 필름이 하부 진공척 상에 올려진 상태에서 웨이퍼 필름의 바코드가 형성된 가장자리부를 상기 하부 진공척의 상부면과 이격되게 들어 올리는 리프팅 유닛; 및 상기 리프팅 유닛에 의해 들어 올려진 웨이퍼 필름의 가장자리부를 폴딩하는 폴딩 유닛;을 포함한다. |
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