OLED FSPM PRESS CUTTING APPARUTUS OF ENCAPSULATION FILM FOR OLED PANEL

The present invention relates to a press cutting device of an encapsulant (FSPM) for an OLED panel and, more specifically, to a press cutting which comprises a knife for cutting an encapsulant (FSPM) for an OLED panel, wherein an inner reinforcing plate and/or an outer reinforcing plate are formed a...

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Bibliographische Detailangaben
Hauptverfasser:	RYU JAE SEOL, HONG KYUNG KI, KIM MIN KYUN, CHUN CHOON SUP, SONG CHI OK, KIM HYUNG TAE, LEE DAE HYUCK, KIM HAE HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a press cutting device of an encapsulant (FSPM) for an OLED panel and, more specifically, to a press cutting which comprises a knife for cutting an encapsulant (FSPM) for an OLED panel, wherein an inner reinforcing plate and/or an outer reinforcing plate are formed along an inner circumferential surface and/or an outer circumferential surface of the knife. OLED 패널용 봉지재(FSPM)의 프레스 재단장치에 관한 것으로서, 보다 구체적으로, 상기 재단 장치는 OLED 패널용 봉지재(FSPM)를 절단하기 위한 나이프를 포함하며, 상기 나이프의 내주면 및/또는 외주면을 따라 내측보강판 및/또는 외측보강판이 형성되어 있는 것에 특징이 있다.