Cleaning Composition for Copper Removal and Method of Cleaning Semiconductor Manufacturing Equipment Using Cleaning Composition for Copper Removal

Disclosed are a cleaning agent composition for removing copper and a method for cleaning a semiconductor manufacturing facility using the cleaning agent composition for removing copper. The present invention comprises: 25-35 parts by weight of ammonium thioglycolate; and 65-75 parts by weight of wat...

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Bibliographische Detailangaben
1. Verfasser:	LEE YOUN HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	Disclosed are a cleaning agent composition for removing copper and a method for cleaning a semiconductor manufacturing facility using the cleaning agent composition for removing copper. The present invention comprises: 25-35 parts by weight of ammonium thioglycolate; and 65-75 parts by weight of water. According to the present invention, copper by-products generated in a chemical mechanical polishing (CMP) process of a semiconductor wafer can be very effectively removed, and at the same time the contamination of semiconductor equipment in the process of removing the copper by-products can be minimized. 구리 제거용 세정제 조성물 및 구리 제거용 세정제 조성물을 이용한 반도체 제조 설비의 세정 방법이 개시된다. 본 발명은 티오글리콜산 암모늄(AMMONIUM THIOGLYCOLATE) 25 내지 35 중량부와 물 65 내지 75 중량부를 포함한다. 본 발명에 따르면, 반도체 웨이퍼의 CMP 공정에서 발생되는 구리 부산물을 매우 효과적으로 제거할 수 있게 될 뿐만 아니라, 구리 부산물의 제거 과정에서의 반도체 장비의 오염을 최소화할 수 있게 된다.