COMPOSITION OF ALKOXYSILYL-FUNCTIONALIZED EPOXY RESIN AND COMPOSITE THEREOF

The present invention relates to an epoxy resin mixture comprising an alkoxysilylated epoxy resin and a specific alicyclic epoxy resin, an epoxy composition comprising an optional acrylic polymer resin, an inorganic filler, and a curing agent, a composite thereof, and an article comprising the same....

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Bibliographische Detailangaben
Hauptverfasser:	KIM YUN JU, PARK SU JIN, PARK SOOK YEON, CHUN HYUN AEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention relates to an epoxy resin mixture comprising an alkoxysilylated epoxy resin and a specific alicyclic epoxy resin, an epoxy composition comprising an optional acrylic polymer resin, an inorganic filler, and a curing agent, a composite thereof, and an article comprising the same. The present invention exhibits improved thermal expansion properties by using a specific cycloaliphatic epoxy resin together with alkoxysilylated epoxy. The epoxy composition of the present invention can be used in semiconductor materials, semiconductor components, semiconductor devices, electrical and electronic materials, electrical and electronic components, electrical and electronic devices and the like. 알콕시실릴화 에폭시 수지와 특정한 지환족 에폭시 수지를 포함하는 에폭시 수지 혼합물, 선택적인 아크릴계 고분자 수지, 무기 필러 및 경화제를 포함하는 에폭시 조성물, 이의 복합체 및 이를 포함하는 물품에 관한 것이다. 알콕시실릴화 에폭시에 특정한 지환족 에폭시 수지를 함께 사용함으로써 개선된 열팽창 특성을 나타낸다. 본 발명의 에폭시 조성물은 반도체 소재, 반도체 부품, 반도체 장치, 전기전자 소재, 전기전자 부품, 및 전기전자 장치 등에 사용될 수 있다.