Heat source device substrate support device and substrate processing facility

The present invention relates to a heat source device, a substrate supporting device, and a substrate processing facility having the same. The heat source device includes: a chamber in which an internal space in which a substrate is processed is formed; a substrate support device installed in the ch...

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Hauptverfasser: SONG, DAE SEOK, YEON, KANG HEUM, NAM, WON SIK
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Sprache:eng ; kor
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creator SONG, DAE SEOK
YEON, KANG HEUM
NAM, WON SIK
description The present invention relates to a heat source device, a substrate supporting device, and a substrate processing facility having the same. The heat source device includes: a chamber in which an internal space in which a substrate is processed is formed; a substrate support device installed in the chamber to stably support the substrate; and a heat source device installed in the chamber to uniformly heat the substrate. The substrate can be uniformly heated, and the substrate can be stably supported. 본 발명은 열원 장치, 기판 지지장치 및 이를 구비하는 기판 처리 설비에 관한 것으로서, 기판이 처리되는 내부 공간이 형성되는 챔버와, 기판을 안정적으로 지지하도록 챔버에 설치되는 기판 지지장치 및 기판을 균일하게 가열하도록 상기 챔버에 설치되는 열원장치를 포함하여, 기판을 균일하게 가열할 수 있고, 기판의 안정적으로 지지할 수 있다.
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The substrate can be uniformly heated, and the substrate can be stably supported. 본 발명은 열원 장치, 기판 지지장치 및 이를 구비하는 기판 처리 설비에 관한 것으로서, 기판이 처리되는 내부 공간이 형성되는 챔버와, 기판을 안정적으로 지지하도록 챔버에 설치되는 기판 지지장치 및 기판을 균일하게 가열하도록 상기 챔버에 설치되는 열원장치를 포함하여, 기판을 균일하게 가열할 수 있고, 기판의 안정적으로 지지할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211208&amp;DB=EPODOC&amp;CC=KR&amp;NR=102335630B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211208&amp;DB=EPODOC&amp;CC=KR&amp;NR=102335630B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG, DAE SEOK</creatorcontrib><creatorcontrib>YEON, KANG HEUM</creatorcontrib><creatorcontrib>NAM, WON SIK</creatorcontrib><title>Heat source device substrate support device and substrate processing facility</title><description>The present invention relates to a heat source device, a substrate supporting device, and a substrate processing facility having the same. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Heat source device substrate support device and substrate processing facility
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