Heat source device substrate support device and substrate processing facility

The present invention relates to a heat source device, a substrate supporting device, and a substrate processing facility having the same. The heat source device includes: a chamber in which an internal space in which a substrate is processed is formed; a substrate support device installed in the ch...

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Bibliographische Detailangaben
Hauptverfasser:	SONG, DAE SEOK, YEON, KANG HEUM, NAM, WON SIK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a heat source device, a substrate supporting device, and a substrate processing facility having the same. The heat source device includes: a chamber in which an internal space in which a substrate is processed is formed; a substrate support device installed in the chamber to stably support the substrate; and a heat source device installed in the chamber to uniformly heat the substrate. The substrate can be uniformly heated, and the substrate can be stably supported. 본 발명은 열원 장치, 기판 지지장치 및 이를 구비하는 기판 처리 설비에 관한 것으로서, 기판이 처리되는 내부 공간이 형성되는 챔버와, 기판을 안정적으로 지지하도록 챔버에 설치되는 기판 지지장치 및 기판을 균일하게 가열하도록 상기 챔버에 설치되는 열원장치를 포함하여, 기판을 균일하게 가열할 수 있고, 기판의 안정적으로 지지할 수 있다.