LEAD FREE SOLDER COMPOSITIONS AND MANUFACTURING METHOD OF THE SAME

An embodiment of the present invention is to provide a lead-free solder composition and a method for manufacturing the same. More particularly, the present invention is to provide a lead-free solder composition exhibiting excellent solderability and mechanical properties using a composite including...

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Bibliographische Detailangaben
Hauptverfasser:	KANG HYE JUN, RAJENDRAN SRI HARINI, JUNG JAE PIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	An embodiment of the present invention is to provide a lead-free solder composition and a method for manufacturing the same. More particularly, the present invention is to provide a lead-free solder composition exhibiting excellent solderability and mechanical properties using a composite including ceramic powder and high-entropy alloy nanopowder, and a method for manufacturing the same. According to an embodiment of the present invention, a bonding composition comprises a composite of a metal alloy containing Sn, a ceramic nanopowder, and a high-entropy alloy nanopowder. 본 발명의 일 실시예에 의한 접합 조성물은 Sn을 포함하는 금속 합금 및 세라믹 나노 분말 및 고 엔트로피 합금 나노 분말의 복합체를 포함한다.