NON-CYANIDE ELECTROLESS GOLD PLATING METHOD AND NON-CYANIDE ELECTROLESS GOLD PLATING COMPOSITION

The present invention relates to an electroless palladium plating method and electroless palladium plating composition and a non-cyanide electroless gold plating method and non-cyanide electroless gold plating composition using the same. The present invention provides the electroless palladium plati...

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Bibliographische Detailangaben
Hauptverfasser:	TAE HO LEE, HYUK SUK KWON, DEOK GON HAN, TAE HYON SUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to an electroless palladium plating method and electroless palladium plating composition and a non-cyanide electroless gold plating method and non-cyanide electroless gold plating composition using the same. The present invention provides the electroless palladium plating method, which is able to address the problem that a void and a pin hole are generated on a surface of copper including a gold strike pre-treatment process, prevent the local erosion in a palladium plating process, and block the elution of copper ions with a palladium plated chamber, and the electroless palladium plating composition, which is able to plate with palladium with a high purity. In addition, after performing the electroless palladium plating, the present invention performs the non-cyanide electroless gold plating, thereby completely forming a gold plating layer and having excellent final solder bonding characteristics and wire bonding properties. In addition, provided is a non-cyanide electroless gold plating composition which is able to increase the stability of the gold plating bath, and provide an excellent exterior and uniform thickness of gold-plated film as well as a uniform plating speed. 본 발명은 무전해 팔라듐 도금방법과 무전해 팔라듐 도금용 조성물 및 이를 이용한 비시안계 무전해 금 도금방법과 무전해 금 도금용 조성물에 관한 것으로, 금 스트라이크 전처리 공정을 포함하여 구리 표면에 보이드 및 핀홀이 발생되는 문제를 해결함으로써, 팔라듐 도금시 국부침식 현상 발생을 방지하고, 팔라듐 도금조로 구리이온의 용출을 차단할 수 있는 무전해 팔라듐 도금방법과 고순도 팔라듐 도금이 가능한 무전해 팔라듐 도금용 조성물을 제공한다. 또한, 상기 무전해 팔라듐 도금 후 비시안계 무전해 금 도금을 함으로써, 금 도금층이 온전하게 형성되어, 최종 솔더 접합특성과 와이어 본딩성이 우수한 비시안계 무전해 금 도금방법과, 금 도금욕의 안정성을 높이고, 일정한 도금속도 및 금도금 피막의 우수한 외관 및 균일한 두께를 제공하는 비시안계 무전해 금 도금용 조성물을 제공한다.