BONDING COMPOSITION AND BONDING METHOD USING THE SAME

An embodiment of the present invention provides a bonding composition and a bonding method using the same. More particularly, provided are a bonding composition that is light, mechanically strong, and excellent in thermal and electrical conductivity, and a bonding method using the same. According to...

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Bibliographische Detailangaben
Hauptverfasser:	RAJENDRAN SRI HARINI, HWANG SEUNG JUN, JUNG JAE PIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	An embodiment of the present invention provides a bonding composition and a bonding method using the same. More particularly, provided are a bonding composition that is light, mechanically strong, and excellent in thermal and electrical conductivity, and a bonding method using the same. According to an embodiment of the present invention, a bonding composition comprises a metal alloy containing Sn, a carbon structure, and a high entropy alloy nanopowder. 본 발명의 일 실시예에 의한 접합 조성물은 Sn을 포함하는 금속 합금, 탄소 구조체 및 고 엔트로피 합금 나노 분말을 포함한다.