PROCESSING APPARATUS AND METHOD
Provided are a treatment device and a treatment method applied thereto. The treatment device comprises: a support part which is provided in the air and on which an object to be treated can be placed; a chamber part which is disposed on one side of the support part and has an open portion facing the...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Provided are a treatment device and a treatment method applied thereto. The treatment device comprises: a support part which is provided in the air and on which an object to be treated can be placed; a chamber part which is disposed on one side of the support part and has an open portion facing the object to be treated; a first discharging part, of which at least a portion is disposed in the chamber part; a second discharging part, of which at least a portion is disposed in the chamber part; an inspection part which is connected to the first and second discharging parts and inspects defects in the object to be treated; and a source supply part connected to the chamber part so as to be able to spray a source for depositing a thin film. The treatment device and the treatment method can inspect and repair the object to be treated provided in the air.
본 발명은, 대기 중에 마련되고, 피처리물을 안착시킬 수 있는 지지부, 지지부의 일측에 배치되고, 피처리물과 마주보는 부분이 개구되는 챔버부, 적어도 일부가 챔버부에 배치되는 제1 방출부, 적어도 일부가 챔버부에 배치되는 제2 방출부, 제1 및 제2 방출부와 연결되고, 피처리물의 결함을 검사하는 검사부, 및 박막 증착용 소스를 분사할 수 있도록 챔버부와 연결되는 소스 공급부를 포함하는 처리 장치 및 이에 적용되는 처리 방법으로서, 대기 중에 마련된 피처리물을 검사 및 리페어할 수 있는 처리 장치 및 방법이 제시된다. |
---|