EMI shielding material for circuit board and manufacturing method of PCB using the same

The present invention relates to an electromagnetic wave shielding material which is laminated on the surface of a circuit board to shield electromagnetic waves. The electromagnetic shielding material comprises a sponge-type ultra-thin copper foil made of different metals, and a conductive adhesive...

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Bibliographische Detailangaben
Hauptverfasser:	PARK MYONG WHAN, CHUN SUNG WOOK, KIM HO GYUN, SONG JIN SU, HONG JUN MO, PARK HYEONG GYU, LEE DAE HOON, KANG YOUN BONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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