EMI shielding material for circuit board and manufacturing method of PCB using the same

The present invention relates to an electromagnetic wave shielding material which is laminated on the surface of a circuit board to shield electromagnetic waves. The electromagnetic shielding material comprises a sponge-type ultra-thin copper foil made of different metals, and a conductive adhesive...

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Bibliographische Detailangaben
Hauptverfasser:	PARK MYONG WHAN, CHUN SUNG WOOK, KIM HO GYUN, SONG JIN SU, HONG JUN MO, PARK HYEONG GYU, LEE DAE HOON, KANG YOUN BONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an electromagnetic wave shielding material which is laminated on the surface of a circuit board to shield electromagnetic waves. The electromagnetic shielding material comprises a sponge-type ultra-thin copper foil made of different metals, and a conductive adhesive layer bonded to the sponge-type ultra-thin copper foil. The conductive adhesive layer comprises a polymer resin, conductive filler and conductive polymer. It is possible to improve an electromagnetic wave shielding effect. 본 발명은 회로기판의 표면에 합지되어 전자파를 차폐하는 전자파 차폐 소재로서, 이종의 금속으로 이루어진 스펀지형 금속박과, 상기 스펀지형 금속박에 결합된 전도성 접착제층을 포함하고, 상기 전도성 접착제층은 고분자 수지, 도전성 필러 및 전도성 고분자를 포함하는 것을 특징으로 한다.