HIGH HEAT DISSIPATION STRUCTURE OF LED MODULE AND LED LIGHTING APPARATUS

The present invention relates to a high heat dissipation structure of an LED module and an LED lighting device having the same. More specifically, the present invention relates to a high heat dissipation structure of an LED module which is provided in an LED module in which at least one LED is arranged on a substrate so as to smoothly dissipate heat generated from the LED module, and an LED lighting device having the same. To this end, the high heat dissipation structure of an LED module comprises: thermally conductive powder (110) made of metal; a heat dissipation sheet (120) including graphite; a heat dissipation body (130) including a plate (131), a plurality of heat dissipation rods (132), and a heat dissipation fin (133), and dissipating heat transferred from an LED module (10); and a heat dissipation plate (140) located between the heat dissipation sheet (120) and the plate (131) and having a single or a plurality of the LED modules (10) arranged thereon. 본 발명은 엘이디 모듈의 고방열구조 및 이를 구비한 엘이디 조명장치에 관한 것으로써, 더욱 상세하게는 기판 상에 적어도 하나의 엘이디가 배치되는 엘이디모듈에 구비되어 엘이디모듈에서 발생되는 열을 원활하게 방열하기 위한 엘이디모듈의 고방열구조 및 이를 구비한 엘이디 조명장치에 관한 것이다.