3 Trivalent Chromium Plating Solution and Crack Free Plating Method Using The Same
The present invention provides a trivalent chromium plating solution and a chromium plating process, which can form chromium plating having a predetermined thickness without forming a crack by appropriately controlling a hydrogen generation reaction. The present invention provides a pulse-reverse pl...
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| creator | BANG SEON MYUNG YEO WOON YOUNG BAECK SUNG HYEON JEON JIN KU BON IL LEE GWANG HUN |
| description | The present invention provides a trivalent chromium plating solution and a chromium plating process, which can form chromium plating having a predetermined thickness without forming a crack by appropriately controlling a hydrogen generation reaction. The present invention provides a pulse-reverse plating method optimized for forming crack-free trivalent chromium plating by controlling the hydrogen generation reaction, and a chromium plating product with excellent durability without a crack while using eco-friendly trivalent chromium by providing the trivalent chromium plating solution.
본 발명은 수소발생반응을 적절히 조절하여 크랙을 형성하지 않으면서도 일정한 두께를 가지는 크롬도금을 형성할 수 있는 3 가 크롬 도금액 및 크롬도금 공정을 제공하는 것을 목적으로 한다. 본 발명은 수소발생반응을 제어하여 크랙프리 3가 크롬도금 형성에 최적화된 펄스-리버스 도금방법과 이를 위한 3 가 크롬 도금액을 제공하여 친환경적인 3 가 크롬을 사용하면서도 크랙이 없어 내구성이 뛰어난 크롬도금제품을 제공할 수 있는 효과가 있다. |
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본 발명은 수소발생반응을 적절히 조절하여 크랙을 형성하지 않으면서도 일정한 두께를 가지는 크롬도금을 형성할 수 있는 3 가 크롬 도금액 및 크롬도금 공정을 제공하는 것을 목적으로 한다. 본 발명은 수소발생반응을 제어하여 크랙프리 3가 크롬도금 형성에 최적화된 펄스-리버스 도금방법과 이를 위한 3 가 크롬 도금액을 제공하여 친환경적인 3 가 크롬을 사용하면서도 크랙이 없어 내구성이 뛰어난 크롬도금제품을 제공할 수 있는 효과가 있다.</description><language>eng ; kor</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190821&DB=EPODOC&CC=KR&NR=102012739B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190821&DB=EPODOC&CC=KR&NR=102012739B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BANG SEON MYUNG</creatorcontrib><creatorcontrib>YEO WOON YOUNG</creatorcontrib><creatorcontrib>BAECK SUNG HYEON</creatorcontrib><creatorcontrib>JEON JIN</creatorcontrib><creatorcontrib>KU BON IL</creatorcontrib><creatorcontrib>LEE GWANG HUN</creatorcontrib><title>3 Trivalent Chromium Plating Solution and Crack Free Plating Method Using The Same</title><description>The present invention provides a trivalent chromium plating solution and a chromium plating process, which can form chromium plating having a predetermined thickness without forming a crack by appropriately controlling a hydrogen generation reaction. The present invention provides a pulse-reverse plating method optimized for forming crack-free trivalent chromium plating by controlling the hydrogen generation reaction, and a chromium plating product with excellent durability without a crack while using eco-friendly trivalent chromium by providing the trivalent chromium plating solution.
본 발명은 수소발생반응을 적절히 조절하여 크랙을 형성하지 않으면서도 일정한 두께를 가지는 크롬도금을 형성할 수 있는 3 가 크롬 도금액 및 크롬도금 공정을 제공하는 것을 목적으로 한다. 본 발명은 수소발생반응을 제어하여 크랙프리 3가 크롬도금 형성에 최적화된 펄스-리버스 도금방법과 이를 위한 3 가 크롬 도금액을 제공하여 친환경적인 3 가 크롬을 사용하면서도 크랙이 없어 내구성이 뛰어난 크롬도금제품을 제공할 수 있는 효과가 있다.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgyVggpyixLzEnNK1FwzijKz80szVUIyEksycxLVwjOzyktyczPU0jMS1FwLkpMzlZwK0pNhcv7ppZk5KcohBaDOCEZqQrBibmpPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7Uk3jvI0MDIwNDI3NjSycnQmDhVADs0N4E</recordid><startdate>20190821</startdate><enddate>20190821</enddate><creator>BANG SEON MYUNG</creator><creator>YEO WOON YOUNG</creator><creator>BAECK SUNG HYEON</creator><creator>JEON JIN</creator><creator>KU BON IL</creator><creator>LEE GWANG HUN</creator><scope>EVB</scope></search><sort><creationdate>20190821</creationdate><title>3 Trivalent Chromium Plating Solution and Crack Free Plating Method Using The Same</title><author>BANG SEON MYUNG ; YEO WOON YOUNG ; BAECK SUNG HYEON ; JEON JIN ; KU BON IL ; LEE GWANG HUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR102012739BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>BANG SEON MYUNG</creatorcontrib><creatorcontrib>YEO WOON YOUNG</creatorcontrib><creatorcontrib>BAECK SUNG HYEON</creatorcontrib><creatorcontrib>JEON JIN</creatorcontrib><creatorcontrib>KU BON IL</creatorcontrib><creatorcontrib>LEE GWANG HUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BANG SEON MYUNG</au><au>YEO WOON YOUNG</au><au>BAECK SUNG HYEON</au><au>JEON JIN</au><au>KU BON IL</au><au>LEE GWANG HUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>3 Trivalent Chromium Plating Solution and Crack Free Plating Method Using The Same</title><date>2019-08-21</date><risdate>2019</risdate><abstract>The present invention provides a trivalent chromium plating solution and a chromium plating process, which can form chromium plating having a predetermined thickness without forming a crack by appropriately controlling a hydrogen generation reaction. The present invention provides a pulse-reverse plating method optimized for forming crack-free trivalent chromium plating by controlling the hydrogen generation reaction, and a chromium plating product with excellent durability without a crack while using eco-friendly trivalent chromium by providing the trivalent chromium plating solution.
본 발명은 수소발생반응을 적절히 조절하여 크랙을 형성하지 않으면서도 일정한 두께를 가지는 크롬도금을 형성할 수 있는 3 가 크롬 도금액 및 크롬도금 공정을 제공하는 것을 목적으로 한다. 본 발명은 수소발생반응을 제어하여 크랙프리 3가 크롬도금 형성에 최적화된 펄스-리버스 도금방법과 이를 위한 3 가 크롬 도금액을 제공하여 친환경적인 3 가 크롬을 사용하면서도 크랙이 없어 내구성이 뛰어난 크롬도금제품을 제공할 수 있는 효과가 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | 3 Trivalent Chromium Plating Solution and Crack Free Plating Method Using The Same |
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