3 Trivalent Chromium Plating Solution and Crack Free Plating Method Using The Same
The present invention provides a trivalent chromium plating solution and a chromium plating process, which can form chromium plating having a predetermined thickness without forming a crack by appropriately controlling a hydrogen generation reaction. The present invention provides a pulse-reverse pl...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention provides a trivalent chromium plating solution and a chromium plating process, which can form chromium plating having a predetermined thickness without forming a crack by appropriately controlling a hydrogen generation reaction. The present invention provides a pulse-reverse plating method optimized for forming crack-free trivalent chromium plating by controlling the hydrogen generation reaction, and a chromium plating product with excellent durability without a crack while using eco-friendly trivalent chromium by providing the trivalent chromium plating solution.
본 발명은 수소발생반응을 적절히 조절하여 크랙을 형성하지 않으면서도 일정한 두께를 가지는 크롬도금을 형성할 수 있는 3 가 크롬 도금액 및 크롬도금 공정을 제공하는 것을 목적으로 한다. 본 발명은 수소발생반응을 제어하여 크랙프리 3가 크롬도금 형성에 최적화된 펄스-리버스 도금방법과 이를 위한 3 가 크롬 도금액을 제공하여 친환경적인 3 가 크롬을 사용하면서도 크랙이 없어 내구성이 뛰어난 크롬도금제품을 제공할 수 있는 효과가 있다. |
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