Ti etchant Composition for Undercut prevention of an redistribution layer and/or a multi layer

The present invention relates to a selective titanium etchant composition for a rewiring layer or a composite film. The titanium etchant composition according to the present invention has an excellent undercut prevention effect by minimizing the etching rate of a copper film in a rewiring layer or a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SONG, JUNG HWAN, KIM, BYEOUNG TAK, HAN, NA, LIM, AH HYEON, JO, SUNG IL, LEE, JUN WOO, JEON, SEONG SIK, LEE, SOK HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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