Wafer Processing Apparatus Having Particle Sensor

According to the present invention, provided is a wafer processing apparatus having a particle detecting sensor, which comprises: a wafer transfer unit holding a wafer and transferring the same within a processing area that a wafer processing process is performed; and a particle detecting sensor dis...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HONG SOON SUK, KIM, DONG JU, HWANG, MYUNG HWAN
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:According to the present invention, provided is a wafer processing apparatus having a particle detecting sensor, which comprises: a wafer transfer unit holding a wafer and transferring the same within a processing area that a wafer processing process is performed; and a particle detecting sensor disposed in a predetermined position of the wafer transfer unit and determining whether or not particles are present on the transferring route of the wafer held on the wafer transfer unit. 본 발명에 따른 파티클 감지센서를 포함하는 웨이퍼 가공장치는, 웨이퍼를 거치하여 웨이퍼 가공 공정이 이루어지는 공정영역 내로 이송시키는 웨이퍼 이송유닛 및 상기 웨이퍼 이송유닛의 기 설정된 위치에 구비되어 상기 웨이퍼 이송유닛에 거치된 웨이퍼의 이송 경로 상에 파티클이 존재하는지의 여부를 판단하는 파티클 감지센서를 포함한다.