METHOD AND APPARATUS FOR REMOVING PARTICLE
The present invention relates to a method for removing particles and an apparatus thereof. The method for removing particles according to the present invention includes the following steps: applying an adhesive solution on one side of a particle removing member; semi-drying the adhesive solution app...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a method for removing particles and an apparatus thereof. The method for removing particles according to the present invention includes the following steps: applying an adhesive solution on one side of a particle removing member; semi-drying the adhesive solution applied on the particle removing member into gel; removing particles attached to a chip with the adhesive gel of the particle removing member; removing the adhesive gel of the particle removing member to which the particles are attached; and applying a new adhesive solution on the particle removing member from which the adhesive gel is removed. According to the present invention, the particles attached to the chip can be efficiently removed and damage to components can be minimized.
본 발명은 파티클 제거 방법 및 그 장치에 관한 것으로, 본 발명은 파티클제거부재의 한쪽에 점착액을 묻히는 단계; 상기 파티클제거부재에 묻은 점착액을 반건조시켜 젤(gel)화시키는 단계; 상기 파티클제거부재의 점착젤로 칩에 부착된 파티클을 제거하는 단계; 상기 파티클이 붙은 파티클제거부재의 점착젤을 제거하는 단계; 상기 점착젤이 제거된 파티클제거부재에 새로운 점착액을 묻히는 단계를 포함한다. 본 발명에 따르면, 칩에 부착된 파티클을 효율적으로 제거할 뿐만 아니라 부품의 손실을 최소화한다. |
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