Cleaning composition for soldering flux residues

Provided is a cleaner composition for soldering flux residues comprising a non-ionic surfactant, a complexing agent, an inorganic phosphate compound, a corrosion inhibitor and water. Additionally, provided is a method for removing a solder flux that removes the flux by making the composition be in c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM, IK BEOM, KANG, BYOUNG GEOL, YANG, WOO CHAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES CANDLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a cleaner composition for soldering flux residues comprising a non-ionic surfactant, a complexing agent, an inorganic phosphate compound, a corrosion inhibitor and water. Additionally, provided is a method for removing a solder flux that removes the flux by making the composition be in contact with the solder flux. The composition of the present invention can remove flux residues without causing corrosion of copper, gold, silver, tin, lead, and alloys thereof, which are metal materials of a solder region, by containing each component in an appropriate amount. 비이온계 계면활성제, 착화제, 무기계 인산 화합물, 부식방지제 및 물을 포함하는 땜납 플럭스 잔류물 세정제 조성물이 제공된다. 또한 상기 조성물을 땜납 플럭스에 접촉시킴으로써 상기 플럭스를 제거하는 땜납 플럭스의 제거방법이 제공된다.