BONDING TOOL AND MANUFACTURING METHOD THEREOF

The present invention relates to a bonding tool including, a shank part and a tip part bonded to the lower part of the shank part. The tip part includes a substrate and a vapor deposition film deposited on the lower surface of the substrate. A metal layer is formed between the lower part of the shan...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK, JONG KEUK, BAIK, YOUNG JOON, CHAE, KI WOONG, RHYU, JEA WEON, LEE, WOOK SEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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