BONDING TOOL AND MANUFACTURING METHOD THEREOF

The present invention relates to a bonding tool including, a shank part and a tip part bonded to the lower part of the shank part. The tip part includes a substrate and a vapor deposition film deposited on the lower surface of the substrate. A metal layer is formed between the lower part of the shan...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PARK, JONG KEUK, BAIK, YOUNG JOON, CHAE, KI WOONG, RHYU, JEA WEON, LEE, WOOK SEONG
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a bonding tool including, a shank part and a tip part bonded to the lower part of the shank part. The tip part includes a substrate and a vapor deposition film deposited on the lower surface of the substrate. A metal layer is formed between the lower part of the shank part and the tip part. A plurality of partial bonding parts is formed on both sides of the metal layer so that the lower surface of the shank part is partially bonded to one surface of the metal layer and one surface of the tip part is partially bonded to the other surface of the metal layer. 본 발명은 샹크부와, 상기 샹크부의 하부에 접합되는 선단부를 포함하는 본딩 툴로서, 상기 선단부는 기판과, 상기 기판의 하면에 증착되는 증착막을 포함하고, 상기 샹크부의 하부와 상기 선단부 사이에는 금속층이 개재되며, 상기 샹크부의 하부면과 상기 금속층의 일면이 부분적으로 접합되도록 하고, 상기 금속층의 타면과 상기 선단부의 일면이 부분적으로 접합되도록, 상기 금속층의 양면에는 각각 복수의 부분 접합부가 형성되어 있는 본딩 툴에 관한 것이다.