High heat-resistant thermosetting resin composition

The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG, JAE HOON, BAE, MAN UK, KIM, SUNG RYONG, BANG, YUN HYUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!