High heat-resistant thermosetting resin composition

The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JUNG, JAE HOON, BAE, MAN UK, KIM, SUNG RYONG, BANG, YUN HYUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a form of three different types of phenol, cresol, and dimerless novolak, and a bisphenol A-type epoxy resin. 본 발명은 에폭시계 수지, 경화제, 경화촉진제를 포함하는 열경화성 에폭시 수지 조성물에 있어서, 상기 에폭시계 수지는 3종류의 서로 다른 페놀, 크레졸, 디멀리스노볼락(Novolac)형 에폭시 수지 및 비스페놀 A형 에폭시 수지인 것을 특징으로 하는 열경화성 고내열 수지 조성물을 특징으로 한다.