High heat-resistant thermosetting resin composition
The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a...
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creator | JUNG, JAE HOON BAE, MAN UK KIM, SUNG RYONG BANG, YUN HYUK |
description | The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a form of three different types of phenol, cresol, and dimerless novolak, and a bisphenol A-type epoxy resin.
본 발명은 에폭시계 수지, 경화제, 경화촉진제를 포함하는 열경화성 에폭시 수지 조성물에 있어서, 상기 에폭시계 수지는 3종류의 서로 다른 페놀, 크레졸, 디멀리스노볼락(Novolac)형 에폭시 수지 및 비스페놀 A형 에폭시 수지인 것을 특징으로 하는 열경화성 고내열 수지 조성물을 특징으로 한다. |
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본 발명은 에폭시계 수지, 경화제, 경화촉진제를 포함하는 열경화성 에폭시 수지 조성물에 있어서, 상기 에폭시계 수지는 3종류의 서로 다른 페놀, 크레졸, 디멀리스노볼락(Novolac)형 에폭시 수지 및 비스페놀 A형 에폭시 수지인 것을 특징으로 하는 열경화성 고내열 수지 조성물을 특징으로 한다.</description><language>eng ; kor</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170517&DB=EPODOC&CC=KR&NR=101736659B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170517&DB=EPODOC&CC=KR&NR=101736659B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG, JAE HOON</creatorcontrib><creatorcontrib>BAE, MAN UK</creatorcontrib><creatorcontrib>KIM, SUNG RYONG</creatorcontrib><creatorcontrib>BANG, YUN HYUK</creatorcontrib><title>High heat-resistant thermosetting resin composition</title><description>The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a form of three different types of phenol, cresol, and dimerless novolak, and a bisphenol A-type epoxy resin.
본 발명은 에폭시계 수지, 경화제, 경화촉진제를 포함하는 열경화성 에폭시 수지 조성물에 있어서, 상기 에폭시계 수지는 3종류의 서로 다른 페놀, 크레졸, 디멀리스노볼락(Novolac)형 에폭시 수지 및 비스페놀 A형 에폭시 수지인 것을 특징으로 하는 열경화성 고내열 수지 조성물을 특징으로 한다.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2yEzPUMhITSzRLUotziwuScwrUSjJSC3KzS9OLSnJzEtXAInnKSTn5xbkF2eWZObn8TCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gQwNDc2MzM1NLJydDY-JUAQD_CS44</recordid><startdate>20170517</startdate><enddate>20170517</enddate><creator>JUNG, JAE HOON</creator><creator>BAE, MAN UK</creator><creator>KIM, SUNG RYONG</creator><creator>BANG, YUN HYUK</creator><scope>EVB</scope></search><sort><creationdate>20170517</creationdate><title>High heat-resistant thermosetting resin composition</title><author>JUNG, JAE HOON ; BAE, MAN UK ; KIM, SUNG RYONG ; BANG, YUN HYUK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR101736659BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>JUNG, JAE HOON</creatorcontrib><creatorcontrib>BAE, MAN UK</creatorcontrib><creatorcontrib>KIM, SUNG RYONG</creatorcontrib><creatorcontrib>BANG, YUN HYUK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JUNG, JAE HOON</au><au>BAE, MAN UK</au><au>KIM, SUNG RYONG</au><au>BANG, YUN HYUK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High heat-resistant thermosetting resin composition</title><date>2017-05-17</date><risdate>2017</risdate><abstract>The present invention relates to a highly heat-resistant thermosetting resin composition. More specifically, the present invention relates to a thermosetting epoxy resin composition containing an epoxy-based resin, a curing agent, and a curing accelerator. The epoxy-base resin is an epoxy resin in a form of three different types of phenol, cresol, and dimerless novolak, and a bisphenol A-type epoxy resin.
본 발명은 에폭시계 수지, 경화제, 경화촉진제를 포함하는 열경화성 에폭시 수지 조성물에 있어서, 상기 에폭시계 수지는 3종류의 서로 다른 페놀, 크레졸, 디멀리스노볼락(Novolac)형 에폭시 수지 및 비스페놀 A형 에폭시 수지인 것을 특징으로 하는 열경화성 고내열 수지 조성물을 특징으로 한다.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | High heat-resistant thermosetting resin composition |
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