Installing Discharge Resistor Structure for Capacitor
The present invention relates to an installation structure of a discharge resistor for a capacitor built into a housing. The capacitor built into a housing comprises: capacitor devices (100) having a dielectric film wound and formed thereon and conductive thermal spray surfaces formed on both sides...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to an installation structure of a discharge resistor for a capacitor built into a housing. The capacitor built into a housing comprises: capacitor devices (100) having a dielectric film wound and formed thereon and conductive thermal spray surfaces formed on both sides thereof; a housing case (200) including device housing spaces (H) in which the capacitor devices (100) are built in and arranged; and a first and a second bus bar forming portion (310, 320) electrically connected to the thermal spray surfaces of the capacitor devices (100). The capacitor further comprises a discharge resistor (400) mounted on one outer side of the housing case (200) to discharge residual charge charged in the capacitor when the capacitor is separated from an input terminal, so as to prevent an electric shock accident. The housing case (200) includes: a floor plate (10) having a plurality of partitioning walls (15) formed to protrude vertically along the longitudinal direction so as to partition and form the device housing spaces (H) in which the capacitor devices (200) are housed; elongated sidewall plates (20) facing the thermal spray surfaces of the capacitor devices (200); and cross wall plates (30, 40) connecting both respective ends of the elongated sidewall plates (20). The discharge resistor (400) is mounted on the outer surface of a rear wall plate (10) of the housing case (200), and the housing case (200) includes a step portion for mounting the discharge resistor (80) formed on the outer surface of the rear wall plate (10), wherein the step portion for mounting the discharge resistor (80) includes first and second step portions (81, 85) protruding outwardly and horizontally to be spaced apart from each other.
유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(100)들과, 상기 커패시터 소자(100)들이 내장, 배열되는 소자 안치공간(H)를 구비한 하우징 케이스(200)와, 상기 커패시터 소자(100)들의 용사면에 전기적으로 연결되는 제1, 제2 부스바 형성부(310, 320)를 포함하여 구성되는 하우징 내장형 커패시터에 있어서, 상기 하우징 케이스(200)의 일면 외측에 장착되어 커패시터가 입력단자와 분리된 경우 커패시터에 충전되어 있는 잔류 전하를 방전시켜 감전 사고를 방지하는 방전 저항기(400)를 더 포함하여 구성되고, 상기 방전저항기(400)는 상기 하우징 케이스(200)의 후벽판(10) 외면에 장착되고, 상기 하우징 케이스(200)는 상기 후벽판(10) 외면에 형성된 방전저항기 탑재용 단턱부(80)를 포함하고, 상기 방전저항기 탑재용 단턱부(80)는 수평하게 외곽으로 서로 이격되게 돌출되어 대향되는 두개의 제1, 제2 단턱(81, 85)들로 구성되는 것을 특징으로 하는 하우징 내장형 커패시터의 방전 저항기 장착 구조. |
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