Z fastening method of layered plate using Z-pin

Provided is a method of fastening stacked plates using a Z-pin, capable of preventing a break in a connection portion caused by mechanical pressure and increasing a connecting force between the stacked plates when the stacked plats are connected to each other. The method includes: a first step of st...

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Bibliographische Detailangaben
Hauptverfasser: LEE, HONG KWON, KWON, YONG WON, HA, JONG ROK, KU, HYOUN MO, JUNG, KYUNG WOO
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:Provided is a method of fastening stacked plates using a Z-pin, capable of preventing a break in a connection portion caused by mechanical pressure and increasing a connecting force between the stacked plates when the stacked plats are connected to each other. The method includes: a first step of stacking a plurality of plates to be fastened, which are made of fiber reinforced resin, so that preset connection portion are mutually aligned before the plates are hardened; a second step of arranging, on the connection portions, a base reinforcing plate, which is a thin plate and made of thermoplastic fiber reinforced resin, and a connection reinforcing member including a plurality of Z-pins protruding along a bottom surface part of the base reinforcing plate; a third step of pressing the base reinforcing plate downwards so that the Z-pins are inserted into the plated to be fastened; and a fourth step of hardening the connection reinforcing member and the plates into one body, wherein the third step includes heating the base reinforcing plate so that the base reinforcing plate is plasticized and coherently connected along a top surface of the connection portions. 보다 상세하게는 적층판재의 결합시 기계적인 압력에 의한 체결부의 파손을 방지하고, 적층판재 간 결합력이 향상되도록, 본 발명은 섬유강화수지로 구비된 복수개의 결합대상판재가 경화 전의 상태에서 각각에 기설정된 체결부분이 상호 정렬되도록 적층되는 제1단계; 얇은 판상의 열가소성 섬유강화수지로 구비된 베이스보강판과, 상기 베이스보강판의 하면부를 따라 돌설된 복수개의 Z핀을 포함하는 체결보강부재가 상기 체결부분의 상부에 배치되는 제2단계; 상기 Z핀이 상기 결합대상판재의 내부로 삽입되도록 상기 베이스보강판이 하측으로 가압되는 제3단계; 및 상기 체결보강부재 및 상기 결합대상판재가 일체로 경화되는 제4단계를 포함하되, 상기 제3단계는, 상기 베이스보강판이 가소화되어 상기 체결부분의 상면을 따라 밀착 결합되도록 상기 베이스보강판이 가열되는 단계를 포함함을 특징으로 하는 Z핀을 이용한 적층판재의 체결방법을 제공한다.