ATOMIC LAYER DEPOSITION OF PLATINUM GROUP METAL THIN FILMS

Disclosed is an atomic layer deposition method of a platinum group metal thin film. The atomic layer deposition method of a platinum group metal thin film comprises: a step of preprocessing H_2S or NH_3 on a substrate; and a step of forming a platinum group metal thin film on the substrate. As such,...

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Bibliographische Detailangaben
Hauptverfasser:	JEONG, DOO SEOK, BAEK, SEUNG HYUB, KIM, SEONG KEUN, KWON, BEOM JIN, PYEON, JUNG JOON, CHOI, JI WON, KIM, JIN SANG, KANG, CHONG YUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Disclosed is an atomic layer deposition method of a platinum group metal thin film. The atomic layer deposition method of a platinum group metal thin film comprises: a step of preprocessing H_2S or NH_3 on a substrate; and a step of forming a platinum group metal thin film on the substrate. As such, the present invention enables a continuous deposition of the thin film by controlling a size and distribution of platinum group nanoparticles. 본 발명은 HS 또는 NH를 기판상에 전처리하는 단계 및 상기 기판 상에 백금족 박막을 형성하는 단계를 포함하는 것을 특징으로 하는 백금족 박막의 원자층 증착방법을 개시한다.