METAL COPPER CLAD LAMINATE CAPABLE OF WITHSTAND VOLTAGE MEASUREMENT AND METHOD OF MANUFACTURING THE SAME

Disclosed are a metal copper clad laminate capable of withstanding voltage measurement and a manufacturing method thereof which increases a withstanding voltage to a desired level to measure a voltage and secure excellent reliability of adhesion. According to the present invention, the metal copper...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: JEONG, BYOUNG JIK
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Disclosed are a metal copper clad laminate capable of withstanding voltage measurement and a manufacturing method thereof which increases a withstanding voltage to a desired level to measure a voltage and secure excellent reliability of adhesion. According to the present invention, the metal copper clad laminate capable of withstanding voltage measurement comprises: a metal plate having a recess; an adhesive layer attached to the recess of the metal plate; an insulation layer to cover the recess of the metal plate by the adhesive layer; and a copper clad laminated on the insulation layer. 내전압을 원하는 수준으로 높여서 전압 측정하는 것이 가능하며, 우수한 접합 신뢰성을 확보할 수 있는 내전압 측정이 가능한 동박적층판 및 그 제조 방법에 대하여 개시한다. 본 발명에 따른 내전압 측정이 가능한 동박적층판은 리세스를 구비하는 금속판; 상기 금속판의 리세스 내에 부착된 접착제층; 상기 접착제층에 의해 상기 금속판의 리세스를 덮는 절연층; 및 상기 절연층 상에 적층된 동박;을 포함하는 것을 특징으로 한다.