A FLOORING FOR ARREST OF NOISE

The present invention relates to a floor material for preventing noise, comprising: a honeycomb panel which is composed of a honeycomb structure; and upper and lower fiber plywood which is coupled to the top and bottom surfaces of the honeycomb panel to be integrated and is made of hemp. The floor m...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN, HYE SU, SHIN, HYE WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BUILDING BUILDING MATERIALS CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS ROOFS STRUCTURAL ELEMENTS WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	The present invention relates to a floor material for preventing noise, comprising: a honeycomb panel which is composed of a honeycomb structure; and upper and lower fiber plywood which is coupled to the top and bottom surfaces of the honeycomb panel to be integrated and is made of hemp. The floor material for preventing noise according to the present invention reduces the total weight thereof by applying a honeycomb panel composed of a honeycomb structure; improves thermal conductivity by attaching upper and lower fiber plywood made of hemp while preventing noise, thereby improving heating efficiency when the floor material is used for an indoor floor of a building where floor heating is performed when compared with a floor material made of wood. 본 발명은 소음방지용 바닥재에 관한 것으로, 허니컴 구조로 이루어지는 허니컴 패널과, 상기 허니컴 패널의 상면과 하면에 일체로 결합되되 마섬유를 이용해 제작되는 상부 및 하부 섬유합판으로 이루어지는 것을 특징으로 한다. 본 발명에 따른 소음방지용 바닥재는 허니컴 구조로 이루어지는 허니컴 패널을 적용하여 바닥재의 전체적인 무게를 줄이고, 소음을 방지하면서도 마섬유를 이용해 제작되는 상부 및 하부 섬유합판을 부착하여 열전도율을 향상시켜 바닥난방이 이루어지는 통상의 건물 내 실내공간 바닥에 적용시 기존 목재 등으로 이루어지는 바닥재에 비해 난방 효율이 높은 장점이 있다.