SEMICONDUCTOR PACKAGE

Provided is a semiconductor package having a lead frame for mounting a transistor device for preventing malfunction. The semiconductor package according to the present invention comprises a lead frame including at least one transistor die attaching pad having a first transistor device and a second transistor device arranged, a driver die attaching pad having a driver semiconductor chip arranged, a first driver lead electrically connected to the driver semiconductor chip, and a second driver lead arranged between the first driver lead and at least one transistor die attaching pad; a chip bonding wire electrically connecting a first transistor device and the driver semiconductor chip; a first transistor bonding wire electrically connecting the first driver lead and a second transistor device; and a first insulator arranged on the second driver lead for insulation between the second driver lead and the first transistor bonding wire.