LED ENCAPTULATION STRUCTURE AND MANUFACTURING METHOD THEREOF

LED ENCAPTULATION STRUCTURE AND MANUFACTURING METHOD THEREOF

Disclosed are an LED encapsulation structure and a manufacturing method thereof. The structure to encapsulate an LED chip attached on a substrate according to the present invention includes a first encapsulant which encapsulates the LED chip, and a second encapsulant which is formed on the first enc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHOE, HYUN SU, MOON, CHEOL HEE
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed are an LED encapsulation structure and a manufacturing method thereof. The structure to encapsulate an LED chip attached on a substrate according to the present invention includes a first encapsulant which encapsulates the LED chip, and a second encapsulant which is formed on the first encapsulant. The refractive indexes of the first encapsulant and the second encapsulant are larger than the refractive index of the LED chip and are smaller than the refractive index of air. The refractive index of the first encapsulant is larger than the refractive index of the second encapsulant.