SUBSTRATE STRUCTURE INCLUDING THROUGH HOLE ELECTRODE AND METHOD OF MANUFACTURING THE SAME

A substrate structure according to the present invention includes a base substrate having a through hole and a through-hole electrode which is formed in the through hole and penetrates the base substrate. The through hole includes a single opening part embedded from the upper surface of the base sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUH, SU JEONG, CHO, KYU SUNG, NAM, AN SIK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A substrate structure according to the present invention includes a base substrate having a through hole and a through-hole electrode which is formed in the through hole and penetrates the base substrate. The through hole includes a single opening part embedded from the upper surface of the base substrate and a plurality of fine opening parts which are extended from the lower end of the single opening part to the lower surface of the base substrate facing the upper part. The through hole electrode is formed in the single opening part and the fine opening parts.