METHOD OF CORRECTION OF DEFECT LOCATION USING PREDETERMINED WAFER IMAGE TARGETS

Disclosed is a method for compensating a wafer pattern defect position using a predetermined target image, which finds out an actual defect position, by: obtaining a die image by setting-scanning of a wafer; finding an original form of a specific pattern in the die image and then storing an image and a position in a die of the original form of the specific pattern; obtaining real-time images by real-time inspection and scanning as to an inspection target wafer; obtaining the position by finding the original form of the specific pattern stored in the real-time imaged by an image processing method; finding the amount of separation between the position of the original form of the specific pattern and the position of the previously stored original form of the specific pattern through comparison thereof, under the premise that the position of the original form of the specific pattern in the real-time images is deviated from an accurate position due to a mechanical error factor of an inspection system; and finding out an actual defect position by summing the amount of separation and a wafer defect position, after detecting the wafer defect position in the inspection scan as considering that the amount of separation reflects the mechanical error factor of the inspection system. According to the present invention, it is possible to remove mechanical inaccuracy generated by the inspection system from the defect position reported by the inspection system, and it is possible to increase the level of inspection precision by improving an image processing process and an optical apparatus constituting an image because an inaccuracy factor of the inspection apparatus depends on the pixel size of the image.