METHOD FOR FORMING POLYCRYSTALLINE SILICON FILM

The present invention relates to a method to form a silicon film and, more specifically, relates to a method to form the silicon film including a pre-processing step in a process to form silicon film. According to an embodiment of the present invention, the method to form the silicon film includes:...

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Hauptverfasser: PARK, SEONG JIN, KIM, KI HO, LEE, KANG WOOK, CHOI, HO MIN, KWON, HYEOK YONG, JUNG, WOO DUCK, OH, WAN SUK, SHIN, SEUNG WOO, CHO, SUNG KIL, LEE, KOON WOO
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creator PARK, SEONG JIN
KIM, KI HO
LEE, KANG WOOK
CHOI, HO MIN
KWON, HYEOK YONG
JUNG, WOO DUCK
OH, WAN SUK
SHIN, SEUNG WOO
CHO, SUNG KIL
LEE, KOON WOO
description The present invention relates to a method to form a silicon film and, more specifically, relates to a method to form the silicon film including a pre-processing step in a process to form silicon film. According to an embodiment of the present invention, the method to form the silicon film includes: the pre-processing step dropping pre-processing gas including one or more elements among N, C, O, and B before a heat treatment when forming a polysilicon film by heat-treating an amorphous silicon film deposited on a base.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR101507381BB1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR101507381BB1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR101507381BB13</originalsourceid><addsrcrecordid>eNrjZND3dQ3x8HdRcPMPAmFfTz93hQB_n0jnoMjgEEcfH08_V4VgTx9PZ38_BTdPH18eBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhLvHWRoYGhqYG5sYejkZGhMnCoAubInLw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR FORMING POLYCRYSTALLINE SILICON FILM</title><source>esp@cenet</source><creator>PARK, SEONG JIN ; KIM, KI HO ; LEE, KANG WOOK ; CHOI, HO MIN ; KWON, HYEOK YONG ; JUNG, WOO DUCK ; OH, WAN SUK ; SHIN, SEUNG WOO ; CHO, SUNG KIL ; LEE, KOON WOO</creator><creatorcontrib>PARK, SEONG JIN ; KIM, KI HO ; LEE, KANG WOOK ; CHOI, HO MIN ; KWON, HYEOK YONG ; JUNG, WOO DUCK ; OH, WAN SUK ; SHIN, SEUNG WOO ; CHO, SUNG KIL ; LEE, KOON WOO</creatorcontrib><description>The present invention relates to a method to form a silicon film and, more specifically, relates to a method to form the silicon film including a pre-processing step in a process to form silicon film. According to an embodiment of the present invention, the method to form the silicon film includes: the pre-processing step dropping pre-processing gas including one or more elements among N, C, O, and B before a heat treatment when forming a polysilicon film by heat-treating an amorphous silicon film deposited on a base.</description><language>eng ; kor</language><subject>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE ; APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CRYSTAL GROWTH ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE ; REFINING BY ZONE-MELTING OF MATERIAL ; SEMICONDUCTOR DEVICES ; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE ; SINGLE-CRYSTAL-GROWTH ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150330&amp;DB=EPODOC&amp;CC=KR&amp;NR=101507381B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150330&amp;DB=EPODOC&amp;CC=KR&amp;NR=101507381B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK, SEONG JIN</creatorcontrib><creatorcontrib>KIM, KI HO</creatorcontrib><creatorcontrib>LEE, KANG WOOK</creatorcontrib><creatorcontrib>CHOI, HO MIN</creatorcontrib><creatorcontrib>KWON, HYEOK YONG</creatorcontrib><creatorcontrib>JUNG, WOO DUCK</creatorcontrib><creatorcontrib>OH, WAN SUK</creatorcontrib><creatorcontrib>SHIN, SEUNG WOO</creatorcontrib><creatorcontrib>CHO, SUNG KIL</creatorcontrib><creatorcontrib>LEE, KOON WOO</creatorcontrib><title>METHOD FOR FORMING POLYCRYSTALLINE SILICON FILM</title><description>The present invention relates to a method to form a silicon film and, more specifically, relates to a method to form the silicon film including a pre-processing step in a process to form silicon film. According to an embodiment of the present invention, the method to form the silicon film includes: the pre-processing step dropping pre-processing gas including one or more elements among N, C, O, and B before a heat treatment when forming a polysilicon film by heat-treating an amorphous silicon film deposited on a base.</description><subject>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE</subject><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CRYSTAL GROWTH</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</subject><subject>REFINING BY ZONE-MELTING OF MATERIAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</subject><subject>SINGLE-CRYSTAL-GROWTH</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3dQ3x8HdRcPMPAmFfTz93hQB_n0jnoMjgEEcfH08_V4VgTx9PZ38_BTdPH18eBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhLvHWRoYGhqYG5sYejkZGhMnCoAubInLw</recordid><startdate>20150330</startdate><enddate>20150330</enddate><creator>PARK, SEONG JIN</creator><creator>KIM, KI HO</creator><creator>LEE, KANG WOOK</creator><creator>CHOI, HO MIN</creator><creator>KWON, HYEOK YONG</creator><creator>JUNG, WOO DUCK</creator><creator>OH, WAN SUK</creator><creator>SHIN, SEUNG WOO</creator><creator>CHO, SUNG KIL</creator><creator>LEE, KOON WOO</creator><scope>EVB</scope></search><sort><creationdate>20150330</creationdate><title>METHOD FOR FORMING POLYCRYSTALLINE SILICON FILM</title><author>PARK, SEONG JIN ; KIM, KI HO ; LEE, KANG WOOK ; CHOI, HO MIN ; KWON, HYEOK YONG ; JUNG, WOO DUCK ; OH, WAN SUK ; SHIN, SEUNG WOO ; CHO, SUNG KIL ; LEE, KOON WOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR101507381BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2015</creationdate><topic>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE</topic><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CRYSTAL GROWTH</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</topic><topic>REFINING BY ZONE-MELTING OF MATERIAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</topic><topic>SINGLE-CRYSTAL-GROWTH</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK, SEONG JIN</creatorcontrib><creatorcontrib>KIM, KI HO</creatorcontrib><creatorcontrib>LEE, KANG WOOK</creatorcontrib><creatorcontrib>CHOI, HO MIN</creatorcontrib><creatorcontrib>KWON, HYEOK YONG</creatorcontrib><creatorcontrib>JUNG, WOO DUCK</creatorcontrib><creatorcontrib>OH, WAN SUK</creatorcontrib><creatorcontrib>SHIN, SEUNG WOO</creatorcontrib><creatorcontrib>CHO, SUNG KIL</creatorcontrib><creatorcontrib>LEE, KOON WOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK, SEONG JIN</au><au>KIM, KI HO</au><au>LEE, KANG WOOK</au><au>CHOI, HO MIN</au><au>KWON, HYEOK YONG</au><au>JUNG, WOO DUCK</au><au>OH, WAN SUK</au><au>SHIN, SEUNG WOO</au><au>CHO, SUNG KIL</au><au>LEE, KOON WOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR FORMING POLYCRYSTALLINE SILICON FILM</title><date>2015-03-30</date><risdate>2015</risdate><abstract>The present invention relates to a method to form a silicon film and, more specifically, relates to a method to form the silicon film including a pre-processing step in a process to form silicon film. According to an embodiment of the present invention, the method to form the silicon film includes: the pre-processing step dropping pre-processing gas including one or more elements among N, C, O, and B before a heat treatment when forming a polysilicon film by heat-treating an amorphous silicon film deposited on a base.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CRYSTAL GROWTH
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
REFINING BY ZONE-MELTING OF MATERIAL
SEMICONDUCTOR DEVICES
SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
SINGLE-CRYSTAL-GROWTH
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
title METHOD FOR FORMING POLYCRYSTALLINE SILICON FILM
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