RESIN COMPOSITIONS FOR ENCAPSULATING MATERIAL OF PHOTOVOLTAIC MODULES

The present invention relates to a resin composition for an encapsulating material of a photovoltaic module which facilitates bubble removal by applying an ethylene-vinyl acetate resin as an encapsulating material in which molecular weight distribution properties are adjusted in order to have excell...

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Bibliographische Detailangaben
Hauptverfasser: KIM, JIN WOO, YOON, SUNG TAEK, SON, CHANG KYU
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a resin composition for an encapsulating material of a photovoltaic module which facilitates bubble removal by applying an ethylene-vinyl acetate resin as an encapsulating material in which molecular weight distribution properties are adjusted in order to have excellent contraction properties while giving sufficient melt flow of a photovoltaic nodule, lowers module failure rate by preventing the deformation of a solar cell and allows a module to be manufactured without a trimming process after using minimum encapsulating material. The present invention provides the resin composition for an encapsulating material of a photovoltaic module including ethylene-vinyl acetate copolymers. The ethylene-vinyl acetate copolymers have 20-40 g/10 minutes of a melt index (ASTM D1238 125°C, 2,16 kg), 25-35 wt% of vinyl acetate, 4-6 of molecular weight distribution (MWD) and 15-20% of a fraction of a weight-average molecular weight of 100,000 or more.