MOLDING APPARATUS FOR LIGHT EMITTING DEVICE PACKAGE

The present invention relates to a molding apparatus for a light emitting device package, capable of molding a molding material of the light emitting device package. The molding apparatus for the light emitting device package includes a close attaching pin which is closely attached to a light path s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, YONG KOANG, CHO, HYUN RYONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a molding apparatus for a light emitting device package, capable of molding a molding material of the light emitting device package. The molding apparatus for the light emitting device package includes a close attaching pin which is closely attached to a light path securing surface or a light emitting device receiving surface to protect the light path securing surface or the light emitting device receiving surface from the molding material when a substrate for the light emitting device package is molded, a moving stand which moves the close attaching pin in a substrate direction, and an elastic member which is installed between the moving stand and the close attaching pin. A restoring force is applied in the elastic member to press the close attaching pin in the substrate direction.