METHOD AND APPARATUS FOR DISCOVERING THE EQUIPMENT CAUSING PRODUCT FAULTS IN MANUFACTURING PROCESS

A method of detecting equipment causing product faults in the manufacturing process according to an embodiment of the present invention includes: acquiring process route data and process result data of a product; calculating contribution ratio of each equipment for the product faults based on the ac...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, HO YEOP, KO, JONG MYOUNG, CHOI, DOO WON, TONG, SEUNG HOON, KIM, CHANG OUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A method of detecting equipment causing product faults in the manufacturing process according to an embodiment of the present invention includes: acquiring process route data and process result data of a product; calculating contribution ratio of each equipment for the product faults based on the acquired data; applying a corrected association rule to the selected equipment based on the calculated contribution ratio in order to regularly create the accumulation effect of the equipment causing the product faults and the route; and calculating a fault equipment determination index based on the calculated contribution ratio and the corrected association rule. According to an embodiment of the present invention, the equipment causing the product faults in the manufacturing process can be effectively detected. In addition, the optimum route for increasing the product yield can be detected.