DOUBLE SIDE OF WAFER POLISHING APPARATUS AND ROLLER TO REMOVAL DOUBLE SIDE POLISHING PAD FOR IT

The present invention relates to a device to polish both sides of a wafer and a roller for the removal of a both sided polishing pad applied to the same, capable of efficiently removing the both sided polishing pad from upper and lower surface plates. According to the present invention, in the devic...

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Bibliographische Detailangaben

1. Verfasser:	BAE, BYUNG JO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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