DOUBLE SIDE OF WAFER POLISHING APPARATUS AND ROLLER TO REMOVAL DOUBLE SIDE POLISHING PAD FOR IT

The present invention relates to a device to polish both sides of a wafer and a roller for the removal of a both sided polishing pad applied to the same, capable of efficiently removing the both sided polishing pad from upper and lower surface plates. According to the present invention, in the device to polish both sides of a wafer and the roller for the removal of the both sided polishing pad applied to the same, the roller for the removal of the both sided polishing pad is installed between a linear gear and an internal gear and after a broken end part of the polishing pad is fixed to the roller, the linear and internal gears move in the opposite direction to the upper and lower surface plates while automatically removing the both sided polishing pad. Therefore, the polishing pad is automatically removed from the surface plates by using the operation of the plates and gears, thereby working time is reduced while at the same time a work load is removed so that work efficiency and productivity are raised, and moreover, upper and lower polishing pads attached to the upper and lower surface plates are removed at the same time so that the efficiency of removing the upper and lower polishing pads from the both sided polishing device is raised.