SUBSTRATE PROCESSING METHOD

The present invention relates to a substrate processing method comprising the steps of changing process time and rotational speed of a substrate according to a change of a process condition to set and store the process time and rotational speed; calculating the number of rotations of the substrate based on the process time and the rotational speed; correcting the rotational speed, when the number of rotations is not an integer, to an integer approximate to a value of the number of rotations and setting the corrected number of rotations; calculating the corrected rotational speed of the substrate based on the corrected number of rotations and the process time; and processing the substrate by the corrected rotational speed during the process time. The present invention, though the process time and the rotational speed of the substrate are changed as necessary, corrects the rotational speed of the substrate by the corrected number of rotations with an integer value and stops the substrate at a position which is the same as a rotation start position, namely controls the rotational speed of the substrate to make the rotation stop position identical to the rotation end position, thereby performing a regular process in overall regions of the substrate.