CHIP ON BOARD TYPE LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

The present invention, for a chip-on-board type light emitting device package capable of enhancing structural reliability and the thermal efficiency, and of reducing manufacturing costs, and a manufacturing method thereof, provides a chip-on-board type light emitting device package comprising a double frame which includes a base frame allowing a plurality of light emitting elements to be mounted, and an electrode frame spaced on the base frame and having two electrodes separated from each other; and a molding unit which is coupled to the double frame to separate the base frame from the electrode frame, and contains an aperture to emit light generated from the light emitting elements, wherein the base frame is configured to include a penetrated hole to which the electrode frame is exposed from a lower part.