SUB MOUNTING SUBSTRATE FOR PACKAGING LIGHT EMITTING DIODE AND METHOD FOR FABRICATING

Disclosed is a fabricating method of a sub-mount substrate for a flip chip type light emitting device. The fabricating method of the sub-mount substrate for a flip chip type light emitting device comprises a first progress step to a fifth progress step. The first progress step is a step of providing...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, DA HYEOK, PARK, SE GEUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Disclosed is a fabricating method of a sub-mount substrate for a flip chip type light emitting device. The fabricating method of the sub-mount substrate for a flip chip type light emitting device comprises a first progress step to a fifth progress step. The first progress step is a step of providing a substrate. The second progress step is a step of forming a first region and a second region having a step by partially etching the substrate. The third step is a step of forming a contact hole passing through the first region and second region. The fourth step is a step of forming an insulating thin film on the surface of the substrate on which the contact hole is formed. The fifth step is a step of forming a conductive layer in the contact hole. The first region and the second region are configured to be in contact with a flip chip for a light-emitting device.