WAFER BUMPING APPARATUS AND BUMPING METHOD USING THE SAME

Disclosed are a wafer bumping apparatus and a bumping method using the same. The wafer bumping apparatus according to the present invention includes: a chuck unit including a chuck on which a wafer is put and a chuck driver to move the chuck; an alignment table including a penetration portion in whi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, SOO KI, HWANG, DAL YEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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