WAFER BUMPING APPARATUS AND BUMPING METHOD USING THE SAME

Disclosed are a wafer bumping apparatus and a bumping method using the same. The wafer bumping apparatus according to the present invention includes: a chuck unit including a chuck on which a wafer is put and a chuck driver to move the chuck; an alignment table including a penetration portion in which the chuck elevates and a first alignment means formed around the penetration portion; a guide rail horizontally disposed around the chuck; a flux mask unit including a flux mask, a flux mask frame having a second alignment means supporting an edge of the flux mask and coupled to the first alignment means, and a first driver to move the flux mask frame along the guide rail; a ball mask unit including a ball mask, a ball mask frame having a third alignment means supporting an edge of the ball mask and coupled to the first alignment means, and a second driver to move the ball mask frame along the guide rail; and a plurality of vision cameras installed at an upper portion of the chuck, to acquire each position value of a plurality of reference marks formed on a wafer. According to the present invention, a position of the wafer may be accurately aligned by confirming an alignment state of a wafer bumping region and a mask hole using the vision cameras in a state that the wafer is close to the flux mask or the ball mask, and accordingly the work accuracy is improved so that a failure rate may be significantly reduced.