EDGE POLISHING APPARATUS FOR SUBSTRATE

The present invention relates to a device for polishing the edge of a substrate capable of facilitating chamfering corresponding to the size of substrates and freely selecting the size, shape, and others of chamfers. The present invention comprises a holding unit having a holder on which the substrates are loaded, a fixing unit for fixing the substrates on the holder, and a linear moving part for linearly moving the holder; and a polishing unit having a supply roller installed to be rotated, a collection roller installed to be rotated while being separated from the supply roller, and a tape member having one end wound on the supply roller and the other end wound on the collection roller and polishing the edge of the substrates while being in contact with the substrates fixed on the holder.