APPARATUS AND METHOD FOR SURFACE TREATMENT OF PRINTED CIRCUIT BOARD

An apparatus for a surface treatment of a printed circuit board comprises a first process container part and a second process container part. The first process container part has a first high-temperature liquid and a melted solder filled inside to be vertically separated by a specific gravity differ...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SONG, JIN HUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An apparatus for a surface treatment of a printed circuit board comprises a first process container part and a second process container part. The first process container part has a first high-temperature liquid and a melted solder filled inside to be vertically separated by a specific gravity difference, and has a board having a metal terminal on at least one side dipped to apply the solder to the metal terminal preheated by the first high-temperature liquid. The second process container part is installed adjacent to the first process container part, and has a jet part inside to jet a second high-temperature liquid to at least one side of the board for etching a part of the solder applied to the metal terminal.